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Effect of Chemical Solution on the Stability of Low-k Films

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Abstract:

The compatibility of chemical solutions with different pH is studied on microporous silica-based (SiOCH) and mesoporous methylsilsesquioxane (MSQ) based low-k materials. The surface and bulk properties of as-deposited and O2/CF4 plasma-treated low-k films have been studied after several wet treatments.

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Info:

Periodical:

Solid State Phenomena (Volumes 103-104)

Pages:

349-352

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.103-104.349

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Online since:

April 2005

Authors:

Els Kesters, Quoc Toan Le, Mikhail R. Baklanov, Werner Boullart, Paul W. Mertens

Keywords:

Contact Angle (CA), Low-k Compatibility, Low-k Films, Spectroscopic Ellipsometry (SE), Strip Plasma

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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References

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