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Mapping of Device Yield Relevant Electrical Si-Wafer Parameters

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Abstract:

With an innovative measurement technique termed “microwave detected photoconductivity” (MDP) it is possible to investigate defects of silicon wafers contact less and topographically by evaluating photoconductivity transients detected via microwave absorption. Thus it is possible to obtain the electrical key parameters (e.g. diffusion length and lifetime) in a contact less, non destructive and topographic way. The method is ideal for the investigation of process induced defects as a function of different processing steps. The inhomogeneities of the diffusion length map of the pure wafer correlate very well with the key parameter map of photosensor devices. Even more details of process induced failures of devices can be detected in detail with MDP. In general, the measurement conditions together with their evaluation can be tuned to nearly ‘predict’ properties and production yield of final devices for a given chain of processing steps.

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Periodical:

Solid State Phenomena (Volumes 131-133)

Pages:

511-516

DOI:

https://doi.org/10.4028/www.scientific.net/SSP.131-133.511

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Online since:

October 2007

Authors:

Kathrin Niemietz, Kay Dornich, Torsten Hahn, A. Helbig, Stefan Hellwig, Karl Heinz Stegemann, J.R. Niklas

Keywords:

Carrier Lifetime, Low Injection , MDP, Silicon, Yield

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© 2008 Trans Tech Publications Ltd. All Rights Reserved

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References

[1] K. Dornich, K. Niemietz, Mt. Wagner, J.R. Niklas: Mater. Sci. Sci. For. Proc. 9 (2006), p.241.

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[2] T. Hahn, S. Schmerler, S. Hahn, K. Niemietz, K. Dornich, J.R. Niklas, B. Gründig-Wendrock: DRIP 2007 in press.

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[3] K. Niemietz, K. Dornich, M. Gosh, A. Müller, J.R. Niklas: Proceeding 21st European Photovoltaic Solar Energy Conference (2006), p.361.

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[4] A. Helbig: diploma thesis TU Berakademie Freiberg Germany (2006) Acknowledgement Financial support and the supply of samples by the ZMD AG, Dresden, Germany is gratefully acknowledged.

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