[1]
P. Yao, P. Liu, J. Liu, Interfacial reaction and shear strength of SnAgCu–xNi/Ni solder joints during aging at 150 °C, Microelectronic Engineering. 86 (2009) 1969-(1974).
DOI: 10.1016/j.mee.2008.12.013
Google Scholar
[2]
D.G. Kim, S.B. Jung, Interfacial reactions and growth kinetics for intermetallic compound layer between In–48Sn solder and bare Cu substrate, Journal of Alloys and Compounds. 386 (2005) 151-156.
DOI: 10.1016/j.jallcom.2004.05.055
Google Scholar
[3]
K. Suganuma, Advances in lead-free electronics soldering. Current Opinion in Solid State and Materials Science. 5 (2001) 55-64.
DOI: 10.1016/s1359-0286(00)00036-x
Google Scholar
[4]
M. Amagai, M. Watanabe, M. Omiya, K. Kishimoto, T. Shibuya, Mechanical characterization of Sn–Ag-based lead-free solders. Microelectronics Reliability. 42 (2002) 951-966.
DOI: 10.1016/s0026-2714(02)00017-3
Google Scholar
[5]
M. Pecht, Y. Fukuda, S. Rajagopal, The impact of lead-free legislation exemptions on the electronics industry, Electronics Packaging Manufacturing, IEEE Transactions. 27 (2004) 221-232.
DOI: 10.1109/tepm.2004.843150
Google Scholar
[6]
B. Vandevelde, M. Gonzalez, P. Limaye, P. Ratchev, E. Beyne, Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages, Microelectronics Reliability. 47 (2007) 259-265.
DOI: 10.1016/j.microrel.2006.09.034
Google Scholar
[7]
J.W. Yoon, S.B. Jung, Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn–3. 5Ag–0. 7Cu solder joint, Journal of Alloys and Compounds. 458 (2008) 200-207.
DOI: 10.1016/j.jallcom.2007.04.014
Google Scholar
[8]
M.S. Suh, C.J. Park, H.S. Kwon, Effects of plating parameters on alloy composition and microstructure of Sn–Bi electrodeposits from methane sulphonate bath, Surface and Coatings Technology. 200 (2006) 3527-3532.
DOI: 10.1016/j.surfcoat.2004.08.162
Google Scholar
[9]
J.H. Kim, M.S. Suh, H.S. Kwon, Effects of plating conditions on the microstructure of 80Sn20Pb electrodeposits from an organic sulphonate bath, Surface and Coatings Technology. 78 (1996) 56-63.
DOI: 10.1016/0257-8972(94)02392-1
Google Scholar
[10]
L.M. Lee, A.A. Mohamad, Interfacial reaction of Sn-Ag-Cu lead-free solder alloy on Cu: A Review, Advances in Materials Science and Engineering. 2013 (2013) 11.
DOI: 10.1155/2013/123697
Google Scholar
[11]
P. Yao, P. Liu, J. Liu, Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu–xNi composite solder joints on electrolytic Ni/Au metallized substrate, Journal of Alloys and Compounds. 462 (2008) 73-79.
DOI: 10.1016/j.jallcom.2007.08.041
Google Scholar
[12]
M. Arra, D. Shangguan, D. Xie, J. Sundelin, T. Lepistö, E. Ristolainen, Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications, Journal of Electronic Materials. 33 (2004) 977-990.
DOI: 10.1007/s11664-004-0025-x
Google Scholar
[13]
E. Bradley, K. Banerji, Effect of PCB finish on the reliability and wettability of ball grid array packages, Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions. 19 (1996) 320-330.
DOI: 10.1109/96.496035
Google Scholar
[14]
G. Ghosh, Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints, Acta Materialia. 49 (2001) 2609-2624.
DOI: 10.1016/s1359-6454(01)00187-2
Google Scholar
[15]
R. Zhang, R. Zhao, F. Guo, Z. Xia, Interfacial reaction between the electroless nickel immersion gold substrate and Sn-based solders, Microelectronics Reliability. 49 (2009) 303-309.
DOI: 10.1016/j.microrel.2008.12.016
Google Scholar
[16]
X. Koh Kai, A.S.M.A. Haseeb, M.M. Arafat, and Y. Goh, Effects of Mn nanoparticles on wettability and intermetallic compounds in between Sn-3. 8Ag-0. 7Cu and Cu substrate during multiple reflow, Quality Electronic Design (ASQED), 4th Asia Symposium, (2012).
DOI: 10.1109/acqed.2012.6320519
Google Scholar