Adhesion Strength of BNT Films Hydrothermally Deposited on Titanium Substrates

Fang Chao Xu; Kazuhiro Kusukawa

doi:10.4028/www.scientific.net/AMR.123-125.399

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HomeAdvanced Materials ResearchAdvanced Materials Research Vols. 123-125Adhesion Strength of BNT Films Hydrothermally...

Adhesion Strength of BNT Films Hydrothermally Deposited on Titanium Substrates

Abstract:

Lead-free piezoelectric (Bi1/2Na1/2)TiO3 (BNT) films were deposited on 1 mm thick pure titanium(Ti) substrates by a hydrothermal method. Tensile tests were performed to quantitatively assess the adhesion strength between BNT films and Ti substrates. Ti substrates were pretreated by chemical polish and mechanical polish respectively prior to BNT film deposition. In the tensile test, the behavior of BNT film exfoliation was investigated by the replica method. The critical Ti substrate strain inducing BNT film exfoliation was determined by the aid of finite element analysis (FEM). In this study, the results revealed that BNT film exfoliations were caused by the strain of Ti substrate, and the mechanical polish pretreatment improved the adhesion of BNT film to Ti substrate.

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Periodical:

Advanced Materials Research (Volumes 123-125)

Pages:

399-402

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.123-125.399

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Online since:

August 2010

Authors:

Fang Chao Xu, Kazuhiro Kusukawa

Keywords:

Adhesion Strength, BNT Film, Hydrothermal Method, Tensile Test, Titanium Substrate

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