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HomeAdvanced Materials ResearchAdvanced Materials Research Vol. 795Thermal Properties of Sn-0.7Cu/re-Al Composite...

Thermal Properties of Sn-0.7Cu/re-Al Composite Lead-Free Solder

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Abstract:

Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminum (0, 3.0, 3.5 and 4.0 wt.% re-Al) particulates produced from aluminum beverage cans were successfully fabricated via powder metallurgy techniques in this study. This paper focuses on the thermal properties focusing on the melting temperature of the new developed Sn-0.7Cu/re-Al lead-free composite solder. The melting temperature (T_m) of the new solders was determined using differential scanning calorimetry (DSC). The melting temperature of the composite solders has showed comparable results with the monolithic solders of Sn-0.7Cu lead-free solder.

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Periodical:

Advanced Materials Research (Volume 795)

Pages:

451-454

DOI:

https://doi.org/10.4028/www.scientific.net/AMR.795.451

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Cite this paper

Online since:

September 2013

Authors:

Mohd Arif Anuar Mohd Salleh, Flora Somidin, N.Z. Noriman, Khairel Rafezi Ahmad, Ramani Mayappan, Noor Farhani Mohd Alui

Keywords:

Lead-Free Composite Solder, Melting Temperature, Recycled-Aluminum

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