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Mechanical and Electrical Properties of Sn-3.5Ag Solder/Cu BGA Packages during Multiple Reflows

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Abstract:

The mechanical and electrical properties of the Sn-3.5Ag solder/Cu BGA packages were investigated as a function of number of reflows. A continuous scallop-shaped Cu6Sn5 intermetallic compound (IMC) layer was formed at the solder/Cu interface upon 1 reflow process. After 3 reflows, very thin layer of Cu3Sn IMC was observed at the Cu6Sn5/Cu interface. As the number of reflows increased, the thickness of these IMCs increased with a cube root of reflow time. Shear force slightly increased up to 4 reflows and then gradually decreased with increasing the number of reflows. The maximum shear force was 11.7N when the thickness of the IMC layers was 3.7㎛. The fracture surfaces of all the specimens showed ductile failure characteristics up to 4 reflows, and then the fraction of the brittle IMC fracture increased with the number of reflows. The electrical resistance of the BGA packages increased with the number of reflows.

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Periodical:

Key Engineering Materials (Volumes 297-300)

Pages:

801-806

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.297-300.801

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Online since:

November 2005

Authors:

Ja Myeong Koo, Young Ho Lee, Sun Kyu Kim, Myung Yong Jeong, Seung Boo Jung

Keywords:

Ball Grid Array BGA, Ball Shear Test, Intermetallic Compound (IMC), Multiple Reflows, Pb-Free Solder, Tin-Silver (Sn-Ag) Solder

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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