Reliability of Flip Chip Package with Underfills under Thermal Shock

Bo In Noh; Seung Boo Jung

doi:10.4028/www.scientific.net/KEM.321-323.1719

Paper Titles

(110) Silicon Hard Master Fabrication Using Wet Etching for Multi-Mode Planar Optical Splitter
p.1704

Development of In-Situ SUB-100nm Particle Detection in Vacuum System
p.1707

Ultrasonic Measurement of Elastic Properties of Nanostructured Alumina
p.1711

A Study on the Measurement System Using an Ultrasonic Sensor in Electron Beam Welding
p.1715

Reliability of Flip Chip Package with Underfills under Thermal Shock
p.1719

The Evaluation of Weldability for AZ31B-H24 and AZ91C-F Mg Alloys in Friction Stir Welding
p.1723

Study on Evaluation of AE Signals at Weld Region of SA 516 Steel
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The Study on Mechanical Properties in Narrow-Gap Welds for SA312 TP347
p.1733

Numerical Simulation of Al-SPCC Weldment
p.1738

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Reliability of Flip Chip Package with Underfills under Thermal Shock

Abstract:

The thermal fatigue properties of the solder joints with various underfills were evaluated by thermal shock test. Flip chip package with electroless nickel-immersion gold plated on Cu pad of FR-4 substrate and the Sn-37Pb solder ball was used. The thermal fatigue crack initiated at the edges of interface between solder and silicon die. The fatigue property of package with underfill, which has a higher glass transition temperature (Tg) and lower coefficient of thermal expansion (CTE) value was better than that of package with underfill having a lower Tg and higher CTE.