Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock

Bo In Noh; Seung Boo Jung

doi:10.4028/www.scientific.net/MSF.510-511.558

Paper Titles

Quantitative Analysis of Micro-Macro Domain Transition of PNN-PT-PZ(x) System at Higher PZ Content
p.542

Effects of Void Formation within the Pb-Free BGA Solder Balls on the Mechanical Joint Strength
p.546

Interfacial Reaction and Joint Strength on Cu UBM with Pb-Free Flip Chip Solder Bumps
p.550

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate
p.554

Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock
p.558

The Effect of Boron on the Sliding Wear Behavior of Iron-Based Hardfacing Alloys for Nuclear Power Plants Valves
p.562

Sliding Wear Behaviors of Steam Generator Tubes in Various Environments
p.566

Fabrication of Lead Free Micro Solder Powder by Melts Dispersion Technique
p.570

Etching Mechanism of Pb-Free Glasses in Acid Solution for Barrier Ribs in Plasma Display Panel
p.574

HomeMaterials Science ForumMaterials Science Forum Vols. 510-511Reliability of Sn-Ag-Cu Flip Chip Package with...

Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock

Abstract:

Thermal fatigue properties of solder joints encapsulated with underfill were studied conducting thermal shock tests. Flip chip package with electroless nickel-immersion gold plated on FR-4 substrate and the Sn-3.0Ag-0.5Cu solder ball was used. The fatigue property of package with underfill was better than the package without it. The fatigue property of package with underfill which has a higher glass transition temperature (Tg) and lower coefficient of thermal expansion (CTE) was better than that of package with underfill with lower Tg and higher CTE.